You are viewing an old version of this page. View the current version.

Compare with Current View Page History

« Previous Version 20 Next »

Overview

A single-wafer load-locked DRIE system for etching of Si (Bosch or unswitched processes) or glass substrates.  Wafers cannot contain any exposed metal.

LMACS NameICPRIE (Alcatel AMS110)
Confluence Labelalcatel-ams110-icprie
Process Area

Plasma Etch

ModelAMS110
VendorAlcatel
Team





System Features

Wafer Handlingpieces (mounted)100 mm150 mm


Gas SpeciesO2C4F8SF6ArCH4He
ICP RF Power3 kW




Chuck RF Power300W LF (300kHz)1kW HF (13.56MHz)



Chuck-20 ºC (min)80 ºC (max)mechanical clampHBC

Documents

Related Documents

  • No labels