Alcatel AMS110 ICPRIE

Overview

A single-wafer load-locked DRIE system for etching of Si (Bosch or unswitched processes) or glass substrates. Wafers cannot contain any exposed metal.

LMACS Name	ICPRIE (Alcatel AMS110)
Confluence Label	alcatel-ams110-icprie
Process Area	Plasma Etch
Model	AMS110
Vendor	Alcatel
Team	Scott Munro Devin Fortier

System Features

Wafer Handling	pieces (mounted)	100 mm	150 mm
Gas Species	O₂	C₄F₈	SF₆	Ar	CH₄	He
ICP RF Power	3 kW
Chuck RF Power	300W LF (300kHz)	1kW HF (13.56MHz)
Chuck	-20 ºC (min)	80 ºC (max)	mechanical clamp	HBC

Documents

Operating Procedure	Alcatel AMS110 ICPRIE SOP
Hazard Assessment	Alcatel AMS110 ICPRIE Hazard Assessment - HA

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