Suss CB6L Bonder

Overview

The SUSS Bonder is available to users who require anodic, silicon fusion, eutectic, or thermo-compressive bonding.

LMACS Name	Suss Bonder
Confluence Label	suss-cb6l-bonder
Process Area	Packaging
Model	CB6L
Vendor	Suss MicroTec
Team	Scott Munro Adam Pettigrew Aaron Hryciw

System Features

Wafer Handling	pieces, 100 mm, 150 mm
Process Temperature	500 °C max. 14% offset on bottom plate temperature: see Suss Bonder Temperature tests
Process Pressure	~5.0e-4–750 Torr
Process Force	8 kN max.
Process Voltage	2000 V max.
Process Current	15 mA max.
Process Gas	N₂ only

Operating Procedure
Bonding Information
Hazard Assessment	Suss CB6L Bonder Hazard Assessment - HA