The following is a list of hazard assessments for nanoFAB tools and processes.
| Title | Assessed By | Date of Assessment | Equipment | Final Assessment | Location | Process | Process Area |
|---|---|---|---|---|---|---|---|
| ABM Mask Aligner Bert HA | Stephanie Bozic |
| ABM Mask Aligner BERT |
| Primary Lithography | Lithography | |
| ABM Mask Aligner Grover HA | Stephanie Bozic |
| ABM Mask Aligner Grover |
| Primary Lithography | Lithography | |
| ABM UV Flood Exposure System - Sunny - HA | Scott Munro |
| ABM UV Flood Exposure System - Sunny |
| Primary Lithography, Cleanroom (W1-062 ECERF) | Lithography | |
| Alcatel AMS110 ICPRIE Hazard Assessment - HA | Scott Munro |
| Alcatel AMS110 ICPRIE |
| Plasma Process Area, Cleanroom (W1-062 ECERF) | Plasma Etch | |
| Allwin AW610 RTA HA |
| Allwin Rapid Thermal Anneal AW610 |
| ECERF W1-062, clean room, dry etch area | Ancillary | ||
| Atomic Force Microscope (Dimension Edge) HA | Shiau-Yin Wu |
| Dimension EDGE AFM |
| CME L2-112 | Characterization | |
| Autosorb iQ HA | Nancy Zhang |
| Autosorb iQ |
| ECERF W1-040 | Characterization | |
| Autosorb Quantachrome 1MP HA | Nancy Zhang |
| Autosorb Quantachrome 1MP |
| ECERF W1-040 | Characterization | |
| Branson 3000 Barrel Etcher - HA |
| Branson 3000 Barrel Etcher |
| W1-062, Clean room | Plasma Etch | ||
| Brewer Spinner and Hotplate HA | Gustavo de Oliveira |
| Brewer Spinner and Hotplate |
| ECERF W1-062 | EBL resist spinning | |
| Bruker XRD HA | Nancy Zhang |
| Bruker XRD D8 Discover |
| ECERF w1-040A | Characterization | |
| Characterization Lab ECERF W1-040 General HA | Nancy Zhang |
| General Tools in ECERF W1-040 |
| ECERF W1-040 | Characterization | |
| Cold Plate (Stir-Kool SK-12D) HA | Gustavo de Oliveira Luiz |
| Cold Plate (Stir-Kool SK-12D) |
| Clean room, secondary lithography area | Lithography | |
| Contact Angle and InterFacial Tension HA | Nancy Zhang |
| Contact Angle FTA-200 |
| ECERF W1-040 | Characterization | |
| Critical Point Dryer Hazard Assessement - HA | Scott Munro |
| Critical Point Dryer |
| Secondary lithography, Cleanroom (W1-062 ECERF) | Ancillary Critical Point Drying | |
| Denton Gold Sputter Unit (for SEM)-HA | Nancy Zhang |
| Denton Gold Sputter Unit (for SEM) |
| ECERF W1-040 | Characterization | |
| Disco Dicing Saw 321 HA | Stephanie Bozic |
| Disco Dicing Saw 321 | Low | 10 K area (Dicing) | Packaging | |
| Disco Dicing Saw 3240 HA | Breanna Cherkawski |
| Disco Dicing Saw 3240 |
| 10 K area (Dicing) | Packaging | |
| Discovery TGA HA | Nancy Zhang |
| Discovery TGA |
| ECERF W1-040 | Characterization | |
| Dymax BlueWave 200 HA |
| Dymax BlueWave 200 |
| ECERF W1-62 | Lithography | ||
| Electron-Beam Evaporation System #1 (Gomez) HA | Aaron Hryciw |
| Electron-Beam Evaporation System #1 (Gomez) |
| 10k area | Deposition | |
| Electron-Beam Evaporation System #2 (PVD-75) HA | Timothy Harrison |
| Electron-Beam Evaporation System #2 (PVD-75) |
| 10k area | Deposition | |
| EVO SEM HA | Shiau-Yin Wu |
| Zeiss EVO MA10 SEM |
| ECERF W1-040 | Characterization | |
| Filmetrics F50 UV Hazard Assessment | Scott Munro |
| Filmetrics F50-UV |
| Secondary lithography, Cleanroom (W1-062 ECERF) | Characterization | |
| Fluxim Paios Spectrometer HA | Nancy Zhang |
| Fluxim Paios Spectrometer |
| ECERF W1-040 | Characterization | |
| Freeze Dryer HA | Nancy Zhang |
| Savant SuperModulyo Freeze Dryer |
| ECERF W1-040 | Characterization | |
| GLAD System (Achilles) HA | Aaron Hryciw |
| GLAD System (Achilles) |
| 10k area | Deposition | |
| Heidelberg MLA150 HA | Gustavo de Oliveira |
| Heidelberg MLA150 |
| Clean room, ECERF W1-062B | Lithography | |
| HF/BOE, titanium, glass, and Borofloat etching HA | Stephanie Bozic |
| Wet Deck 1A, Wet Deck 1B |
| Cleanroom wet aisle 1 | Wet etching with HF-based etchants | |
| Hitachi S-4800 FESEM HA |
| Hitachi S-4800 FESEM |
| CME building L2-125A | Characterization | ||
| IBSS Contamination Control System HA | Haoyang Yu | IBSS Contamination Control System |
| CMEB-L2 | Characterization | ||
| JEOL JEM-ARM200CF (HA) | Haoyang Yu |
| JEOL JEM-ARM200CF |
| CME L2-121 | Characterization | |
| Keithley 4200 SCS Analyzer -HA | Nancy Zhang |
| Keithley 4200-Semiconductor Characterization System (SCS Analyzer) |
| ECERF W1-040 | Characterization | |
| KJLC 150LX ALD HA | Scott Munro |
| KJLC 150LX Atomic Layer Deposition |
| Cleanroom (W1-062) | Deposition | |
| KOH and TMAH Etching Hazard Assessment - HA | Scott Munro |
| Wet Deck 2A |
| Wet Aisle 2, Cleanroom (W1-062 ECERF) | KOH and TMAH Si Etch Process | |
| memsstar Vapour HF Etching System Hazard Assessment - HA | Scott Munro |
| memsstar Vapour HF Etcher |
| Plasma Process Area, Cleanroom (W1-062 ECERF) | Vapour HF Etching Process | |
| Metal etching HA | Stephanie Bozic |
| Wet Deck 1A, Wet Deck 1B |
| Cleanroom | Metal etching (non-HF- and non-TMAH-based etchants) | |
| Minibrute Top/Middle Furnace HA | Tim Harrison | Minibrute Top Furnace (nitrogen/oxygen anneal) Minibrute Middle Furnace (nitrogen/forming gas anneal) |
| 10k area | Ancillary | ||
| Nanoscribe Photonic Professional GT HA | Gustavo de Oliveira |
| Nanoscribe Photonic Professional GT |
| ECERF W1-062, Primary lithography | 2PP 3D printing | |
| Oxford Cobra ICPRIE Hazard Assessment - HA | Scott Munro |
| Oxford Cobra ICPRIE |
| Plasma Process Area, Cleanroom (W1-062 ECERF) | Plasma Etch | |
| Oxford Estrelas ICPRIE Hazard Assessment - HA | Scott Munro |
| Oxford Estrelas ICPRIE (DRIE) |
| Plasma Process Area, Cleanroom (W1-062 ECERF) | Plasma Etch | |
| Oxford NGP80 RIE Hazard Assessment - HA | Scott Munro |
| Oxford NGP80 RIE |
| Plasma Process Area, Cleanroom (W1-062 ECERF) | Plasma Etch | |
| Parylene Deposition System (HA) | Glenn Elaschuk |
| Parylene Deposition System |
| 10K | Deposition | |
| PDMS Process Area Hazard Assessment - HA | Scott Munro |
| PDMS Fumehood, Vacuum Ovens, Desiccator |
| Plasma Process Area, Cleanroom (W1-062 ECERF) | PDMS Process, general use vacuum oven, Desiccation | |
| PDS 2010 Labcoater 2 (Parylene Depostion) HA | Stephanie Bozic |
| PDS 2010 Labcoater 2 |
| 10 K Dicing area | Deposition | |
| Photoresist development - Alkaline developers HA | Gustavo de Oliveira |
|
| ECERF W1-062, Lithography | Photoresist development - Alkaline developers | ||
| Photoresist development - Solvent based developers HA | Gustavo de Oliveira |
|
| ECERF W1-062, Lithography | Photoresist development - Solvent based developers | ||
| Photoresist development - TMAH based developers HA | Gustavo de Oliveira |
|
| ECERF W1-062, Lithography | Photoresist development - TMAH based developers | ||
| Piranha HA | Stephanie Bozic |
| Wet Deck 2B |
| Cleanroom wet aisle 2 | Piranha cleaning | |
| Plasma-Therm Versaline PECVD HA | Tim Harrison |
| Plasma-Therm Versaline PECVD |
| Plasma Process Area, Cleanroom (W1-062) | Deposition | |
| RAITH150 Two EBL System HA | Gustavo de Oliveira |
| RAITH150 Two EBL System |
| ECERF W1-062A | EBL, Lithography | |
| Renishaw inVia Raman Microscope HA | Shiau-Yin Wu, Emmett Yu |
| Renishaw inVia Raman Microscope |
| CME L2-132 | Characterization | |
| Rigaku XRD HA | Nancy Zhang |
| Rigaku XRD Ultima IV |
| ECERF w1-040A | Characterization | |
| Servo Precision Drill Press HA |
| Servo Precision Drill Press |
| 10k area | Packaging | ||
| Spin-bake stations #1 and #2 - HA | Gustavo de Oliveira Luiz |
| Spin Bake Station #1 (Left) and Spin Bake Station #2 (Right) |
| Primary lithography - Clean room | Lithography | |
| Sputtering System #1 (Bob) HA | Timothy Harrison |
| KJLC CMS-18 Sputtering System #1 (Bob) |
| 10k area | Deposition | |
| Sputtering System #2 (Doug) HA | Timothy Harrison |
| KJLC CMS-18 Sputtering System #2 (Doug) |
| 10k area | Deposition | |
| Sputtering System #3 (Floyd) HA | Timothy Harrison |
| Sputtering System #3 (Floyd) |
| 10k area | Deposition | |
| Sputtering System #4 (Moe) HA | Timothy Harrison |
| AJA Orion 8 Sputtering System (Moe) |
| 10k area | Deposition | |
| Suss CB6L Bonder Hazard Assessment - HA | Scott Munro |
| Suss CB6L Bonder |
| Bonding Area, Cleanroom (W1-062 ECERF) | Wafer Bonding | |
| SUSS MA/BA6 HA | Scott Munro |
| SUSS MA6/BA6 Mask Aligner |
| Primary Lithography | Lithography | |
| Tescan Vega3 SEM HA | Shihong Xu |
| Tescan Vega3 SEM |
| ECERF W1-040A | ||
| Toho FLX-2320-S HA | Tim Harrison |
| Toho FLX-2320-S |
| ECERF W1-040 | Characterization | |
| TPT HB16 Wire bonder HA | Gustavo de Oliveira |
| TPT HB16 Wire bonder |
| Characterization Lab, ECERF W1-040 | Packaging | |
| Trion PECVD HA | Aditi Ganji |
| Trion PECVD |
| Plasma Process Area, Cleanroom (W1-062 ECERF) | Deposition | |
| Trion RIE Hazard Assessment - HA | Scott Munro |
| Trion Phantom RIE |
| Plasma Process Area, Cleanroom (W1-062 ECERF) | Plasma Etch | |
| Tystar Tubes 2, 3, and 4 (LPCVD) HA | Tim Harrison | Tystar Tubes 2, 3, and 4 (LPCVD) |
| Plasma Process Area, Cleanroom (W1-062 ECERF) | Deposition | ||
| Tystar Tubes 5, 6, and 7 HA | Tim Harrison | Tystar Tubes 5, 6, and 7 |
| Plasma Process Area, Cleanroom (W1-062 ECERF) | Deposition | ||
| UV - Ozone (Bonder) Hazard Assessment - HA | Scott Munro |
| UV - Ozone (Bonder) Exposure System |
| Plasma Process Area, Cleanroom (W1-062 ECERF) | UV - Ozone Exposure | |
| Wet decks - General use HA | Gustavo de Oliveira |
| Wet decks - General Use |
| Clean room | Wet Processing | |
| Xenon Difluoride (XeF2) Etch System Hazard Assessment - HA | Scott Munro |
| XeF2 Etching System |
| Plasma Process Area, Cleanroom (W1-062 ECERF) | XeF2 Si Etch | |
| Yamato Oven - HA |
| Yamato Oven |
| Primary lithography - Clean room | Lithography | ||
| YES - YES3TA HMDS Oven - HA | Gustavo de Oliveira |
| YES YES3TA HMDS Oven |
| Primary lithography, clean room | Lithography | |
| Zeiss Sigma FeSEM HA | Shiau-Yin Wu |
| Zeiss Sigma FESEM |
| ECERF W1-060A | Characterization | |
| Zeiss Versa Xradia 620 HA | Haoyang (Emmett) Yu |
| Zeiss Versa Xradia 620 |
| CMEB L1-113 | Characterization |