| 10k Litho Fumehood - HA | | | 10k Litho Fumehood | | 10k Litho Area | | |
| ABM Mask Aligner Bert HA | | | ABM Mask Aligner BERT | | Primary Lithography | | |
| ABM Mask Aligner Grover HA | Breanna Cherkawski | | ABM Mask Aligner Grover | | Primary Lithography | | |
| ABM UV Flood Exposure System - Sunny - HA | | | ABM UV Flood Exposure System - Sunny | | Primary Lithography, Cleanroom (W1-062 ECERF) | | |
| Alcatel AMS110 ICPRIE Hazard Assessment - HA | Scott Munro | | Alcatel AMS110 ICPRIE | | Plasma Process Area, Cleanroom (W1-062 ECERF) | | |
| Allwin AW610 RTA HA | | | Allwin Rapid Thermal Anneal AW610 | | ECERF W1-062, clean room, dry etch area | | |
| Alpha-Step IQ - Cleanroom | Scott Munro | | Alpha-Step IQ | | Primary Lithography | | |
| AML Aligner and Wafer Bonder HA | Scott Munro | | AML - AWB-04 Wafer Aligner-Bonder | | Bonding Area, Cleanroom (W1-062 ECERF) | | |
| Atomic Force Microscope (Dimension Edge) HA | Shiau-Yin Wu | | Dimension EDGE AFM | | CME L2-112 | | |
| Autosorb iQ HA | Nastaran Yousefi | | Autosorb iQ | | CME-L2-154 | | |
| Autosorb Quantachrome 1MP HA | Nancy Zhang | | Autosorb Quantachrome 1MP | | ECERF W1-040 | | |
| Branson 3000 Barrel Etcher - HA | | | Branson 3000 Barrel Etcher | | W1-062, Clean room | | |
| Brewer Spinner and Hotplate HA | | | Brewer Spinner and Hotplate | | ECERF W1-062 | | |
| Bruker D8D plus XRD-SAXS HA | Xuehai Tan | | Bruker D8D plus XRD-SAXS | | CME L2-136 | | |
| Bruker XRD HA | Xuehai Tan | | Bruker XRD D8 Discover | | CME L2-136 | | |
| Characterization Lab ECERF W1-040 General HA | Nancy Zhang | | General Tools in ECERF W1-040 | | ECERF W1-040 | | |
| Cold Plate (Stir-Kool SK-12D) HA | Gustavo de Oliveira Luiz | | Cold Plate (Stir-Kool SK-12D) | | ECERF W1-062, clean room, secondary lithography area | | |
| Contact Angle and InterFacial Tension HA | Shihong Xu | | Contact Angle FTA-200 | | L2-154, CME | | Characterization |
| Critical Point Dryer Hazard Assessement - HA | Scott Munro | | Critical Point Dryer | | Secondary lithography, Cleanroom (W1-062 ECERF) | |
Ancillary
Critical Point Drying |
| Denton Gold Sputter Unit (for SEM)-HA | | | | | CME-L2-120 | | |
| Disco Dicing Saw 3240 HA | Breanna Cherkawski | | Disco Dicing Saw 3240 | | 10 K area (Dicing) | | |
| Disco Dicing Saw 3241 HA | Breanna Cherkawski | | Disco Dicing Saw 3241 | | 10 K area (Dicing) | | |
| Discovery TGA HA | Nancy Zhang | | Discovery TGA | | ECERF W1-040 | | Characterization |
| Dymax BlueWave 200 HA | | | Dymax BlueWave 200 | | ECERF W1-62, dry etch area | | |
| Electron-Beam Evaporation System #1 (Gomez) HA | Timothy Harrison | | Electron-Beam Evaporation System #1 (Gomez) | | 10k area | | |
| Electron-Beam Evaporation System #2 (PVD-75) HA | Timothy Harrison | | Electron-Beam Evaporation System #2 (PVD-75) | | 10k area | | |
| Eppendorf Centrifuge 5804R HA | Nastaran Yousefi | | Eppendorf Centrifuge 5804R | | ECERF W1-040 | | |
| EVO SEM HA | Fenglin Liu | | Zeiss EVO MA10 SEM | | ECERF W1-060A | | |
| Filmetrics F50 UV Hazard Assessment | Scott Munro | | Filmetrics F50-UV | | Secondary lithography, Cleanroom (W1-062 ECERF) | | |
| Filmetrics Thickness Monitor (F10-VC) HA | Nastaran Yousefi | | Filmetrics Thickness Monitor (F10-VC) | | CME-L2-128 | | |
| Fluxim Paios Spectrometer HA | | | Fluxim Paios Spectrometer | | CME-L2-154 | | |
| Four-Point Probe (Pro4 4000) HA | | | Four-Point Probe (Pro4 4000) | | CME-L2-128 | | |
| Freeze Dryer HA | Nastaran Yousefi | | | | CME-L2-120 | | |
| GLAD System (Achilles) HA | Tim Harrison | | GLAD System (Achilles) | | 10k area | | |
| Heidelberg MLA150 HA | Gustavo de Oliveira | | Heidelberg MLA150 | | Clean room, ECERF W1-062B | | |
| HF/BOE, titanium, glass, and Borofloat etching HA | | | Wet Deck 1A, Wet Deck 1B, Wet Deck 1C | | Cleanroom wet aisle 1 | | Wet etching with HF-based etchants |
| Hitachi S-4800 FESEM HA |
| | Hitachi S-4800 FESEM | | CME building L2-125A | | |
| IBSS Contamination Control System HA | Haoyang Yu | | IBSS Contamination Control System | | CMEB-L2 | | |
| Inspection microscopes (Nikon L200N and LV150, Zeiss Axiolab) HA | | | Nikon Eclipse L200N Inspection Microscope, Nikon Eclipse LV150 Optical Microscope #1 | | Clean room and 10k area | | |
| J.A. Woollam M2000V Ellipsometer HA | Josh Perkins | | J.A. Woollam M2000V Ellipsometer | | CME-L2-154 | | |
| J.A. Woollam VASE Ellipsometer HA | Josh Perkins | | J.A. Woollam VASE Ellipsometer | | CME-L2-154 | | |
| JEOL JEM-ARM200CF (HA) | Xuehai Tan | | JEOL JEM-ARM200CF | | CME L2-121 | | |
| Keithley 4200 SCS Analyzer -HA | Nastaran Yousefi | | | | CME-L2-154 | | |
| KJLC 150LX ALD Hazard Assessment | Scott Munro | | KJLC 150LX Atomic Layer Deposition | | Cleanroom (W1-062) | | |
| KLA - Alpha-Step IQ Profilometer - Characterization HA | Nastaran Yousefi | | KLA - Alpha-Step IQ Profilometer | | CME-L2-128 | | |
| KOH and TMAH Etching Hazard Assessment - HA | Scott Munro | | Wet Deck 2C | | Wet Aisle 2C, Cleanroom (W1-062 ECERF) | | KOH and TMAH Si Etch Process |
| Leica EM ACE600 HA | Nastaran Yousefi | | Leica EM ACE600 | | CME-L2-120 | | |
| Leica RES102 Ion Mill HA | Nastaran Yousefi | | Leica RES102 Ion Mill | | CME-L2-120 | | |
| Liquid Nitrogen Filling from 230L Tank HA | Nastaran Yousefi | | LN2 230L Tank | | CME-L2-154 | | |
| memsstar Vapour HF Etching System Hazard Assessment - HA | Scott Munro | | memsstar Vapour HF Etcher | | Plasma Process Area, Cleanroom (W1-062 ECERF) | | Vapour HF Etching Process |
| Metal etching HA | Breanna Cherkawski | | Wet Deck 1A, Wet Deck 1B, Wet Deck 1C | | Cleanroom | | Metal etching (non-HF- and non-TMAH-based etchants) |
| Minibrute Top/Middle Furnace HA | Tim Harrison | | Minibrute Top Furnace (nitrogen/oxygen anneal) Minibrute Middle Furnace (nitrogen/forming gas anneal) | | 10k area | | |
| Nanometrics Hall Measurement HA | | | Nanometrics Hall Measurement | | CME-L2-128 | | |
| Nanoscribe Photonic Professional GT HA | Gustavo de Oliveira Luiz | | Nanoscribe Photonic Professional GT | | ECERF W1-062, Primary lithography | | 2PP 3D printing |
| nGauge AFM HA | Nastaran Yousefi | | nGauge AFM | | CME-L2-128 | | |
| Nitric Acid Etching - HA | Breanna Cherkawski | | Wet Deck 1A, Wet Deck 1B, Wet Deck 1C | | Cleanroom | | Metal etching with diluted nitric acid |
| Olympus LEXT OLS3100 Confocal Laser Scanning HA | Josh Perkins | | Olympus LEXT OLS3100 Confocal Laser Scanning | | CME-L2-128 | | |
| Organics Evaporator (Angstrom Covap III) HA | | | Angstrom Covap Thermal Evaporator III | | 10k area | | |
| Oxford Cobra ICPRIE Hazard Assessment - HA | Scott Munro | | Oxford Cobra ICPRIE | | Plasma Process Area, Cleanroom (W1-062 ECERF) | | |
| Oxford Estrelas ICPRIE Hazard Assessment - HA | Scott Munro | | Oxford Estrelas ICPRIE (DRIE) | | Plasma Process Area, Cleanroom (W1-062 ECERF) | | |
| Oxford NGP80 RIE Hazard Assessment - HA | Scott Munro | | Oxford NGP80 RIE | | Plasma Process Area, Cleanroom (W1-062 ECERF) | | |
| Parylene Depostion System HA | Tim Harrison | | Parylene Deposition System | | 10 K Dicing area | | |
| PDMS Process Area Hazard Assessment - HA | Scott Munro | | PDMS Fumehood, Vacuum Ovens, Desiccator | | 10k Lithography - (W1-060B ECERF) | | PDMS Process, general use vacuum oven, Desiccation |
| Perkin-Elmer NIR-UV Spectrophotometer HA | Nastaran Yousefi | | Perkin-Elmer NIR-UV Spectrophotometer | | CME-L2-128 | | |
| Photoresist development - Alkaline developers HA | Breanna Cherkawski | | Developer Station #1 (Left) Developer Station #2 (Right) | | ECERF W1-062, Lithography | | Photoresist development - Alkaline developers |
| Photoresist development - Solvent based developers HA | | | Developer Station #1 (Left) Developer Station #2 (Right) | | ECERF W1-062, Lithography | | Photoresist development - Solvent based developers |
| Photoresist development - TMAH based developers HA | | | Developer Station #1 (Left) Developer Station #2 (Right) | | ECERF W1-062, Lithography | | Photoresist development - TMAH based developers |
| Piranha HA | Breanna Cherkawski | | Wet Deck 2B | | Cleanroom wet aisle 2 | | Piranha cleaning |
| Plasma-Therm Versaline PECVD HA | Tim Harrison | | Plasma-Therm Versaline PECVD | | Plasma Process Area, Cleanroom (W1-062) | | |
| PVA TePla Ion 10Q - HA | | | PVA TePla Ion 10Q Asher | | W1-062, Clean room | | |
| RAITH150 Two EBL System HA | | | RAITH150 Two EBL System | | ECERF W1-062A | | |
| RAITH Voyager EBL System HA | | | Raith Voyager EBL System | | ECERF W1-060, Clean room | | |
| Renishaw inVia Raman Microscope HA | Xuehai Tan | | | | CME L2-132 | | |
| Rigaku XRD HA | Xuehai Tan | | Rigaku XRD Ultima IV | | CME L2-112 | | |
| Servo Precision Drill Press HA | | | Servo Precision Drill Press | | 10k area | | |
| Signatone Four-Point Probe (Cleanroom) HA | | | Four-Point Probe (Pro4 4000) | | ECERF W1-040 | | |
| Sitek - Semitool 870-S Spin Rinse Dryer | | | Sitek - SemiTool 870-S SRD | | Wet Processing | | |
| Sono-Tek ExactaCoat Spray Coater HA | Breanna Cherkawski | | Sono-Tek ExactaCoat Spray Coater | | W1-060B | | |
| Spectrophotometer UV_VIS (Hitachi U-3900H) HA | Nastaran Yousefi | | Spectrophotometer UV_VIS (Hitachi U-3900H) | | CME-L2-128 | | |
| Spin-bake stations #1 and #2 - HA | Gustavo de Oliveira Luiz | | Spin Bake Station #1 (Left) and Spin Bake Station #2 (Right) | | Primary lithography - Clean room | | |
| Sputtering System #1 (Bob) HA | Timothy Harrison | | KJLC CMS-18 Sputtering System #1 (Bob) | | 10k area | | |
| Sputtering System #2 (Doug) HA | Timothy Harrison | | KJLC CMS-18 Sputtering System #2 (Doug) | | 10k area | | |
| Sputtering System #3 (Floyd) HA | Timothy Harrison | | Sputtering System #3 (Floyd) | | 10k area | | |
| Sputtering System #4 (Moe) HA | Timothy Harrison | | AJA Orion 8 Sputtering System (Moe) | | 10k area | | |
| Suss CB6L Bonder Hazard Assessment - HA | Scott Munro | | Suss CB6L Bonder | | Bonding Area, Cleanroom (W1-062 ECERF) | | Wafer Bonding |
| SUSS MA/BA6 HA | Breanna Cherkawski | | SUSS MA6/BA6 Mask Aligner | | Primary Lithography | | |
| Tescan Vega3 SEM HA | Shihong Xu | | Tescan Vega3 SEM | | ECERF W1-040A |
| |
| ThermoFisher Helios Hydra PFIB/SEM HA | Shihong Xu | | ThermoFisher Helios Hydra PFIB/SEM | | L2-117, CME building | | |
| Toho FLX-2320-S HA | Tim Harrison | | Toho FLX-2320-S | | ECERF W1-040 | | |
| TPT HB16 Wire bonder HA | | | TPT HB16 Wire bonder | | Characterization Lab, ECERF W1-040 | | |
| Trion PECVD HA | Tim Harrison | | Trion PECVD | | Plasma Process Area, Cleanroom (W1-062 ECERF) | | |
| Trion RIE Hazard Assessment - HA | Scott Munro | | Trion Phantom RIE | | Plasma Process Area, Cleanroom (W1-062 ECERF) | | |
| Tystar Tubes 2, 3, and 4 (LPCVD) HA | Tim Harrison | | Tystar Tubes 2, 3, and 4 (LPCVD) | | Plasma Process Area, Cleanroom (W1-062 ECERF) | | |
| Tystar Tubes 5, 6, and 7 HA | Tim Harrison | | Tystar Tubes 5, 6, and 7 | | Plasma Process Area, Cleanroom (W1-062 ECERF) | | |
| UV - Ozone (Bonder) Hazard Assessment - HA | Scott Munro | | UV - Ozone (Bonder) Exposure System | | Plasma Process Area, Cleanroom (W1-062 ECERF) | | UV - Ozone Exposure |
| Wet decks - General use HA | | | Wet Deck 1A, Wet Deck 1B, Wet Deck 1C, Wet Deck 2A | | Clean room | | |
| Xenon Difluoride (XeF2) Etch System Hazard Assessment - HA | Scott Munro | | XeF2 Etching System | | Plasma Process Area, Cleanroom (W1-062 ECERF) | | XeF2 Si Etch |
| Yamato Oven - HA | | | Yamato Oven | | Primary lithography - Clean room | | |
| YES - YES3TA HMDS Oven - HA | | | YES YES3TA HMDS Oven | | Primary lithography, clean room | | |
| Zeiss Helium Ion Microscope with Ga-FIB HA | Shihong Xu | | Zeiss Orion HiM/Ga-FIB | | L2-113, CME building | | |