Suss CB6L Bonder

Overview

The SUSS Bonder is available to users who require anodic, silicon fusion, eutectic, or thermo-compressive bonding.

LMACS Name	Suss Bonder
Confluence Label	suss-cb6l-bonder
Process Area	Plasma Etch
Model	CB6L
Vendor	Suss MicroTec
Team	Aaron Hryciw Michael Hume Scott Munro Devin Fortier

System Features

Wafer Handling	pieces	100 mm	150 mm
Process Temperature	500 degC max.	14% Offset on Bottom plate Temp see Suss Bonder Temperature tests
Process Pressure	750 Torr max.	~5.0e-4 Torr min.
Process Force	8kN max.
Process Voltage	2000V max.
Process Current	15mA max.
Process Gas	N₂ only

Operating Procedure
Bonding Information
Hazard Assessment	Suss CB6L Bonder Hazard Assessment - HA