| Equipment | Suss CB6L Bonder |
|---|---|
| Process Area | Wafer Bonding |
| Location | Bonding Area, Cleanroom (W1-062 ECERF) |
| Assessed By | Scott Munro |
| Date of Assessment |
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| Final Assessment |
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Please Review
Carefully review and familiarize yourself with the hazard assessment applicable to your tool or process.