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 Book this tool for wet oxidation processes. For dry oxidation, use Tystar Oxidation (dry). This tube is currently restricted to virgin Si prime wafers, or processed Si/SOI wafers containing silicon oxide or nitride.

Process Gases

Process GasesMax Flow (MFC Range)
N210000 sccm
O25000 sccm
Liquid H2010mL/min

Temperature Range

1550 C1100 C
2550 C1100 C
3550 C1100 C

System Features

Table to highlight system features these can be displayed in the format that makes the most sense for the tool. The table below is an example using an ICP-RIE



Wet Oxide

Dry Oxide


Operating Procedure
Hazard Assessment

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