A Toho/KLA-Tencor FLX Series Wafer Stress Measurement System, the Toho FLX-2320-S is an easy to use tool for the measurement of thin film stress utilizing the wafer curvature technique as measured by either a 670 nm or a 780 nm laser. The tool can produce 3D film stress maps as well as monitor time/temperature dependent stress in thin films up to 200 mm thick.
Round: 3", 4", 5", 6"
Square: 100 mm
|Film Thickness||Up to 200 mm|
|Heating||Up to 500 °C in N2 inert gas|
|3D Stress Mapping||0–180° in 15° increments|
|Hazard Assessment||Toho FLX-2320-S HA|
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