System Features
Wafer Handling | Round: 3", 4", 5", 6" Square: 100 mm |
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Film Thickness | Up to 200 mm |
Stress | 1–4000 MPa |
Heating | Up to 500 °C in N2 inert gas |
3D Stress Mapping | 0–180° in 15° increments |
Documents
Operating Procedure | |
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Hazard Assessment | Toho FLX-2320-S HA |
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