Overview

A Toho/KLA-Tencor FLX Series Wafer Stress Measurement System, the Toho FLX-2320-S is an easy to use tool for the measurement of thin film stress utilizing the wafer curvature technique as measured by either a 670 nm or a 780 nm laser. The tool can produce 3D film stress maps as well as monitor time/temperature dependent stress in thin films up to 200 mm thick.

LMACS NameThin Film Stress Measurement (FLX 2320S)
Confluence Label

toho-flx2320s

Process Area

Characterization

ModelFLX-2320-S
VendorToho / Tencor
Team

Timothy Harrison Aditi Ganji Scott Munro Peng Li Aaron Hryciw 

System Features

Wafer Handling

Round:  3", 4", 5", 6"

Square:  100 mm

Film ThicknessUp to 200 mm
Stress1–4000 MPa
HeatingUp to 500 °C in N2 inert gas
3D Stress Mapping0–180° in 15° increments

Documents

Operating Procedure

Thin Film Stress Measurement - Flexus 2320 SOP

Hazard AssessmentToho FLX-2320-S HA

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