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Book this tool for wet oxidation processes. For dry oxidation, use Tystar Oxidation (dry). This tube is currently restricted to virgin Si prime wafers, or processed Si/SOI wafers containing silicon oxide or nitride. |
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Contacts
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Process Gases
| Process Gases | Max Flow (MFC Range) |
|---|---|
| N2 | 10000 sccm |
| O2 | 5000 sccm |
| Liquid H20 | 10mL/min |
Temperature Range
| Zone | Min | Max |
|---|---|---|
| 1 | 550 C | 1100 C |
| 2 | 550 C | 1100 C |
| 3 | 550 C | 1100 C |
System Features
Table to highlight system features these can be displayed in the format that makes the most sense for the tool. The table below is an example using an ICP-RIE
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| Duration | ||||
| Wet Oxide | ||||
| Dry Oxide |
Documents
| Operating Procedure | |
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| Hazard Assessment | |
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Staff Documents
Drive Folder
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Related Documents
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