| Note | ||||
|---|---|---|---|---|
| ||||
A single-wafer load-locked DRIE system for etching of Si (Bosch or unswitched processes) or glass substrates. Wafers cannot contain any exposed metal. |
| Page properties | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ||||||||||||||||
|
| Show If | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ||||||||||||||
|
| Show If | |||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| |||||||||||||||
Contacts
|
System Features
| Wafer Handling | pieces (mounted) | 100 mm | 150 mm | |||
|---|---|---|---|---|---|---|
| Gas Species | O2 | C4F8 | SF6 | Ar | CH4 | He |
| ICP RF Power | 3 kW | |||||
| Chuck RF Power | 300W LF (300kHz) | 1kW HF (13.56MHz) | ||||
| Chuck | -20 ºC (min) | 80 ºC (max) | mechanical clamp | HBC |
Documents
| Operating Procedure | |
|---|---|
| Hazard Assessment | Alcatel AMS110 ICPRIE Hazard Assessment - HA |
| Show If | ||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ||||||||||||||||||||||||||||||
Staff Documents
Drive Folder
|
Related Documents
| Content by Label | ||
|---|---|---|
|