Used for photoresist developing. With additional training, development of HSQ resist using 25% TMAH on Litho Wet Deck #1. Due to the additional hazard of using this developer, a Buddy is required for after-hours access. |
Contacts
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Wafer Handling | Pieces | 100 mm | 150 mm |
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Utilities | N2 | DI H2O | |
Chemicals Allowed | IPA/Acetone | Developers | TMAH |
Insert links to Google Drive documents OR links to confluence pages that contain the docs
Standard Operating Procedures |
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Staff Documents
Drive Folder |