A planar magnetron sputtering system with three guns, for deposition of metals, or reactive deposition of oxides/nitrides. A substrate holder allows up to a single 150 mm (6") substrate. The third source can be used with magnetic materials. The gun/substrate configuration is designed for co-sputtering. Substrate holder has heating to 200 °C.




LMACS NameSputtering System #2 (Doug)
Process Area

ModelCMS-18
VendorKurt J Lesker
Team

Timothy Harrison Aaron Hryciw Glenn Elaschuk





Serial NumberInsert the equipment serial number
UofA Asset Tag NumberInsert the equipment UofA Asset tag number
Service Contract

   





Contacts


NameCompanyEmailPhone
Technical ContactJean HawkerKJLCjeanh@lesker.com1 412 387 9068
Sales ContactJoey KellerKJLCjoeyk@lesker.com1 416 209 2281



System Features

Sputter Guns3" guns; two standard guns, one gun for magnetic materials; sputter-up configuration
Gas SpeciesAr, O2, N2
Power2 MDX 500 power supplies, DC pulsed power supply, RF power supply for substrate bias (RF etchback)
Substrate HandlingSmall pieces on carrier wafers up to 150 mm diameter full wafers
Substrate HeatingUp to 200 °C
FeaturesSubstrate rotation; capable of co-sputtering; reactive sputtering oxides and nitrides (O2 and N2 process gases)


Documents

Operating Procedure

Doug SOP

Hazard AssessmentSputtering System #2 (Doug) HA


Staff Documents

Service ManualDoug manuals
PM ProcedureDoug PM
System Drawings
Consumables Logsheets

Drive Folder


Related Documents

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