Contact lithography mask aligners |
Contacts
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1 | IR through-wafer imaging for backside alignment (4" diameter wafers with 5" x 5" photomasks only) |
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2 | Tooling: 3", 4", and 6" diameter wafers, 4" x 4" square substrates, and small pieces |
3 | Mask tooling: 5" x 5" or 7" x 7" square photomasks |
4 | UV illumination (365 nm & 405 nm) |
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Operating Procedure | |
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Hazard Assessment | N/A |
Staff Documents
Drive Folder |
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