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System Features
• | Four 3" planar magnetron sources |
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• | Cryo pumped with a base pressure of <1e-7 Torr |
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• | Automatic operation for wafer handling and deposition processing (via control PC) |
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• | Load-locked with 6 shelves per load |
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• | Tooling for 150 mm wafers and smaller |
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• | Process gas: Ar only |
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• | Rotating substrate holder |
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• | Typical uniformity of <5% over a 150 mm wafer. |
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• | RF substrate bias (etch back) |
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