Overview

Used for photoresist developing. With additional training, development of HSQ resist using 25% TMAH on Litho Wet Deck #2. Due to the additional hazard of using this developer, a Buddy is required for after-hours access.

LMACS NameLitho Wet Deck #2, Litho Wet Deck #2 - TMAH
Confluence Labellitho-wet-deck-2
Process Area

Lithography

Model
Vendor
Team

Stephanie Bozic Gustavo de Oliveira Luiz Aaron HryciwMichael Hume Adam Pettigrew



System Features

Wafer HandlingPieces100 mm150 mm
UtilitiesN2DI H2O5 Cycle Dump Rinse
Chemicals AllowedIPA/AcetoneDevelopersTMAH

Key Documents

Standard Operating Procedures


Related Documents