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An atmospheric-pressure quartz tube furnace for general annealing and glass bonding. No metals are allowed in this furnace; metal-containing wafers can be annealed in the Muffle Furnace or Tystar Doped Anneal tool.
Process Gases
Process Gases | Max Flow (MFC Range) |
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N2 | 10000 sccm |
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H2 | 1000 sccm |
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Temperature Range
Zone | Min | Max |
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1 | 500 C | 1100 C |
2 | 500 C | 1100 C |
3 | 500 C | 1100 C |
System Features
Documents
Operating Procedure | |
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Hazard Assessment |
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