Overview

A planar magnetron sputtering system with three guns, for deposition of metals only. The gun/substrate configuration is designed for sequential sputtering.

LMACS NameSputtering System #1 (Bob)
Process Area

Deposition

ModelCMS-18
VendorKurt J Lesker
Team





System Features

Sputter Gun Type3" guns; two standard guns, one gun for magnetic materials; sputter-up configuration
Gas SpeciesAr
Power SupplyMDX 500
Substrate HandlingSmall pieces on carrier wafers up to several 200 mm diameter full wafers
FeaturesSubstrate rotation

Documents

Operating Procedure
Hazard AssessmentSputtering System #1 (Bob) HA