Overview

A planar magnetron sputtering system with three guns, for deposition of metals only. The gun/substrate configuration is designed for sequential sputtering.

LMACS NameSputtering System #1 (Bob)
Process Area

Deposition

ModelCMS-18
VendorKurt J Lesker
Team

Timothy Harrison Aaron Hryciw Glenn Elaschuk





System Features

Sputter Gun Type3" guns; two standard guns, one gun for magnetic materials; sputter-up configuration
Gas SpeciesAr
Power SupplyMDX 500
Substrate HandlingSmall pieces on carrier wafers up to several 200 mm diameter full wafers
FeaturesSubstrate rotation

Documents

Operating Procedure

Bob Sputtering System SOP

Hazard AssessmentSputtering System #1 (Bob) HA

Related Documents