System Features
Sputter Guns | 3" guns; two standard guns, one gun for magnetic materials; sputter-up configuration | ||
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Gas Species | Ar, O2, N2 | ||
Power | 2 MDX 500 power supplies, DC pulsed power supply, RF power supply for substrate bias (RF etchback) | ||
Substrate Handling | Small pieces on carrier wafers up to 150 mm diameter full wafers | ||
Substrate Heating | Up to 150 °C | ||
Features | Substrate rotation; capable of co-sputtering; reactive sputtering oxides and nitrides (O2 and N2 process gases) |
Documents
Operating Procedure | |
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Hazard Assessment | Sputtering System #2 (Doug) HA |
Related Documents