A load-locked, computer-controlled, planar magnetron sputtering system with four sputter guns and RF etch back. Guns 1, 3, and 4 are always loaded with Au, Cr, and Al targets, respectively; the Gun 2 target is swapped upon request.

LMACS NameSputtering System #3 (Floyd)
Process Area


VendorKurt J Lesker

System Features

Four 3" planar magnetron sources; sputter-down configuration
Cryo pumped with a base pressure of <1e-7 Torr
Automatic operation for wafer handling and deposition processing (via control PC)
Load-locked with 6 shelves per load
Tooling for 150 mm wafers and smaller
Process gas:  Ar only
Rotating substrate holder
Typical uniformity of <5% over a 150 mm wafer.
RF substrate bias (etch back)