Overview

A load-locked, computer-controlled, planar magnetron sputtering system with four sputter guns and RF etch back. Guns 1, 3, and 4 are always loaded with Au, Cr, and Al targets, respectively; the Gun 2 target is swapped upon request.

LMACS NameSputtering System #3 (Floyd)
Process Area

Deposition

ModelCMS-18
VendorKurt J Lesker
Team

Timothy Harrison Aaron Hryciw Glenn Elaschuk





System Features

•Four 3" planar magnetron sources; sputter-down configuration
•Cryo pumped with a base pressure of <1e-7 Torr
•Automatic operation for wafer handling and deposition processing (via control PC)
•Load-locked with 6 shelves per load
•Tooling for 150 mm wafers and smaller
•Process gas:  Ar only
•Rotating substrate holder
•Typical uniformity of <5% over a 150 mm wafer.
•RF substrate bias (etch back)



Documents

Operating Procedure

Floyd Sputtering System SOP

Hazard AssessmentSputtering System #3 (Floyd) HA

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