Overview

An AJA Orion 8 planar magnetron sputter system with six 2" sputtering guns, four power supplies (2 DC, 2 RF), and substrate heating. It is a load-locked system with manual specimen transfer and automated (computer-controlled) deposition. The targets in all six guns are switched weekly upon request. Metals, dielectrics, and semiconductor materials may be deposited using this system.

LMACS NameSputtering System #4 (Moe)
Process Area

Deposition

ModelOrion 8
VendorAJA
Team

Aaron Hryciw Glenn Elaschuk Timothy Harrison Devin Fortier





System Features


Six 2" sputtering guns with automated power supply and shutter control; sputter-up configuration


QCM for accurate rate testing immediately prior to deposition (not in situ process monitoring)

Substrate heating to 500 °C using quartz lamps (higher temperatures may be allowed on a case-by-case basis)

RF etchback

Plumbed with N2 and O2‚ for reactive sputtering

Turbo-pumped load lock and process chamber

Maximum substrate size: one 100 mm (4") diameter wafer

Tooling available for small and irregular pieces

Rotating substrate holder

Target Change Schedule

  • Submit new target change requests on LMACS by 5:00 pm on Thursdays. Regular target changes are scheduled on Friday afternoons between 1:00–5:00 pm unless it is a public holiday. To access the LMACS request and be added to the "Frequent users" list, contact Tim Harrison at tr1@ualberta.ca.
  • 2 DC and 2 RF power supplies are currently functioning.
  • Available Si targets:
    • p-type:  purchased from Angstrom Engineering with B = 74 ppm and B = 350 ppm.
    • n-type:  purchased from Plasmaterials, part # PLA135674623110

Documents

Operating Procedure

Sputtering System #4 (Moe) SOP

Hazard AssessmentSputtering System #4 (Moe) HA
QCM Material ParametersQCM Material Parameters

Related Documents