System Features
| 6-pocket e-beam hearth: Al, Ti, Cr, Au, Ag, and Ni. Pocket 5 material (Ag), may be changed out at user request | |
| Alternative approved materials (available with >24 hr notice): Ag, Cu | |
Cryo pumped with a base pressure of <1e-7 Torr; <4e-7 Torr achievable within 30 min pumpdown | |
| Automatic deposition recipes | |
| 300 mm Ø platen with room for substrates up to 150 mm diameter | |
| Rotating substrate holder | |
| Typical uniformity of <5% over a 150 mm wafer, <2% over a 100 mm wafer |
Documents
| Operating Procedure | |
|---|---|
| Hazard Assessment | Electron-Beam Evaporation System #2 (PVD-75) HA |
| QCM Material Parameters | QCM Material Parameters |
| Pocket 5 Material Change | How-To Request an Alternative Approved PVD-75 Material |