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An atmospheric-pressure quartz tube furnace for general annealing and glass bonding. No metals are allowed in this furnace; metal-containing wafers can be annealed in the Muffle Furnace or Tystar Doped Anneal tool.
Process Gases
| Process Gases | Max Flow (MFC Range) |
|---|
| N2 | 10000 sccm |
| H2 | 1000 sccm |
Temperature Range
| Zone | Min | Max |
|---|
| 1 | 500 C | 1100 C |
| 2 | 500 C | 1100 C |
| 3 | 500 C | 1100 C |
System Features
Documents
| Operating Procedure | |
|---|
| Hazard Assessment |
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