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Overview

Six-pocket electron beam evaporation system with computer-controlled, automated deposition.  Deposition materials are restricted to approved metals only.

LMACS NameElectron-Beam Evaporation System #2 (PVD-75)
Confluence Labelpvd-75
Process Area

Deposition

Location10k aisle 1
ModelPVD-75
VendorKurt J Lesker
Team

Timothy Harrison  Glenn Elaschuk Aaron Hryciw 





System Features


6-pocket e-beam hearth:  Al, Ti, Cr, Au, Ag, and Ni. Pocket 5 material (Ag), may be changed out at user request

Alternative approved materials (available with >24 hr notice): Ag, Cu

Cryo pumped with a base pressure of <1e-7 Torr; <4e-7 Torr achievable within 30 min pumpdown


Automatic deposition recipes

300 mm Ø platen with room for substrates up to 150 mm diameter

Rotating substrate holder

Typical uniformity of <5% over a 150 mm wafer, <2% over a 100 mm wafer

Documents

Operating Procedure

PVD-75 Evaporation System SOP

Hazard AssessmentElectron-Beam Evaporation System #2 (PVD-75) HA
QCM Material ParametersQCM Material Parameters
Pocket 5 Material ChangeHow-To Request an Alternative Approved PVD-75 Material

Related Documents

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