Equipment Configuration
Configuration Schedule
Please refer to the Oxford Cobra ICPRIE tool page on LMACS for the liner installation and 100 mm / 150 mm clamp change schedule. By default, the Cobra is in 100 mm mode without liners. Conversions to 150 mm mode can be done by LMACS request; please contact nanoFAB staff for more information.
N.B. Sputter-based etches (e.g., Au, Pt, Cu) are only allowed in the tool when liners are installed. Users must book the tool using ICPRIE (Cobra Sputter Etch) in LMACS and only during the times when liners are installed. The total volume of metal being etched may not exceed 0.04 mm³ (4e7 µm³) between cleaning cycles. This corresponds to etching through a 100 nm thick film with an exposed area of 4 cm² (e.g., ~5% of a 100 mm wafer).
Different pre-process and post-process chamber cleaning recipes are required to be run depending on the tool configuration and the materials being processed. Please contact a nanoFAB staff member if you are unsure of what the proper cleaning schedule for your process should be.
System Features
| Wafer Handling | pieces (mounted) | 100 mm | 150 mm | |
|---|---|---|---|---|
| Gas Species (Inert) | O2 | CHF3 | SF6 | Ar |
| Gas Species (Toxic) | Cl2 | HBr | BCl3 | |
| ICP RF Power | 3 kW | |||
| Chuck RF Power | 300 W | |||
| Chuck | -150 ºC (min) | 300 ºC (max) | mechanical clamp | HBC |
Documents
| Operating Procedure | |
|---|---|
| Hazard Assessment | |
| Process Information |