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Process information for ZrO2 films deposited on the KJLC ALD 150LX system.


Recipe parameters - Thermal ZrO2 (TDMAZ + H2O)

Recipe name

PR - ALD ZrO2 (TDMAZ + H2O) LP

Substrate Temperature (°C)250
TDMAZ Dose (ms)400
Ar Purge 1a (ms)3000
Ar Purge 1b (ms)7000
H2O Dose (ms)20

Ar Purge 2 (ms)

10000

*LP = low pressure, where the Ar flows are reduced prior to dosing.  The Ar flows are reduced, then the TDMAZ dosed for the specified time.  Once done, the Ar flows are returned to normal flows (purge 1a), and the chamber purged for the set purge time (purge 1b).

Uniformity


Film properties

Growth rate (nm/cycle)

0.071

Uniformity, SUP (± %)0.3
Refractive index (λ = 633 nm)2.17

Etch rates

Etch process

Etch rate (nm/min)

BOE (10:1)



HF 49%

Borofloat Etch

Optical constants

Link to VASE .mat data:

Google Drive Live Link
urlhttps://drive.google.com/file/d/1xlxkleY6VtRnc4VUWt95KBjkmIz6SBwX/view?usp=drivesdk


Recipe parameters - Plasma ZrO2 (TDMAZ + O2 Plasma)

Recipe name

PR - PEALD ZrO2 (TDMAZ + O2 plasma) LP

Substrate Temperature (°C)250
TDMAZ Dose (ms)400
Ar Purge 1a (ms)3000
Ar Purge 1b (ms)7000
O2 Plasma Dose (ms)5000

Ar Purge 2 (ms)

5000

*LP = low pressure, where the Ar flows are reduced prior to dosing.  The Ar flows are reduced, then the TDMAZ dosed for the specified time.  Once done, the Ar flows are returned to normal flows (purge 1a), and the chamber purged for the set purge time (purge 1b).

Film properties

Growth rate (nm/cycle)

0.094

Uniformity, SUP (± %)0.7


Uniformity



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Qualification process procedure

Acquisition parameters for metrology are given in the acquisition parameters from the PECVD Standard qual measurements.

  1. Substrates:  Si prime wafers, 100 mm diameter, 525 ± 20 μm thick, SSP, ⟨100⟩, p-type/B, 10–20 Ω•cm
  2. Piranha clean (Wet Process - Piranha - Wet Deck 2B):  15 min in 3:1 H₂SO₄:H₂O₂ + dump rinse + spin-rinse-dry
  3. Deposition ():  [recipe name, dep time, etc.]
  4. Ellipsometry to determine optical constants (VASE Ellipsometer):  Measure at wafer centre.  Initial fitting done using the reference model from JA Woollam (.mat), with the thickness, pole #1 and Magnitude parameters set to fit.  MSE <5.
  5. Thickness mapping (Filmetrics F50-UV):  Use optical constants from ellipsometry.  Uniformity calculated as std_dev/mean from 115 point map, 3 mm edge exclusion.