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titleOverview

The Kurt J. Lesker Company® (KJLC®) ALD150LX™ is an Atomic Layer Deposition (ALD) system designed specifically for advanced research and development (R&D) applications. Innovative ALD150LX™ design features, like our Patented Precursor Focusing Technology™, blended with advanced process capability provide unparalleled flexibility and performance. With an emphasis on enabling and supporting innovative, cutting edge technology at the R&D level, the ALD150LX™ serves not only as a stand-alone platform, but provides connectivity with additional process and analysis modules in a cluster tool configuration.



Page properties
idequipment-properties


LMACS NameALD - KJLC 150LX
Confluence Labelkjlc-150lx-ald
Process Area

Equipment process area
EquipmentAreaDeposition

ModelALD 150LX
VendorKurt J. Lesker (KJL)
Team



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groupnf-staff


Serial NumberTBD
UofA Asset Tag NumberTBD
Service Contract

Status
colourGreen
titleYes
   5yr initial contract with purchase

Label

Status
subtletrue
titlekjlc-150lx-ald

Purchase Info2a. Atomic Layer Deposition - Purchase
Installation2021-08 KJLC 150LX ALD Installation




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Contacts


NameCompanyEmailPhone
Technical ContactNoel O' TooleKurt J Leskernoelo@lesker.com

(412) 387-9137 (o)

(412) 527-0794 (c)

Process SupportBruce TraynorKurt J Leskerbrucer@lesker.com

(412) 387-9200 x 7315 (o)

(412) 735-6480 (c)

Sales ContactJoey KellerKurt J Leskerjoeyk@lesker.com

(416) 209-2281

NA Customer ServiceNorth American Customer ServiceKurt J LeskerNAservice@lesker.com1-800-245-1656



System Features

Substrate Handling

Load locked single wafer transfer

Substrate sizes:

minmaxthickness

2 mm × 2 mm

150 mm ø

5 mm thickness w/o carrier

3.5 mm with carrier


Substrate Heating500 ºC 
Sources

Source 1 - Single Vapour Draw (H2O)

Source 2 - Flow through 

Source 3 - Multi-source Vapour Draw (5 ampoules)

Source 4 - Flow-through heated oven

Materials
  • Aluminium oxide (Al2O3)
    • TMA + H2O
    • TMA + O2 plasma
    • TMA + O3
  • Silicon dioxide (SiO2)
    • 3DMAS + O2 plasma
  • Hafnium oxide (HfO2)
    • TDMAH + H2O
    • TDMAH + O2 plasma
  • Zirconium oxide (ZrO2)
    • TDMAZ + H2O
    • TDMAZ + O2 plasma
  • Silicon nitride (Si3N4)
    • 3DMAS + N2 plasma
  • Titanium nitride (TiN)
    • TiCl4 + N2/H2 plasma
  • Aluminum nitride (AlN)
    • TMA + N2 plasma
Plasma Source Gases

Source 5 - 1 kW RF Remote ICP

  • Argon (Ar)
  • Oxygen (O2)
  • Nitrogen (N2)
  • Hydrogen (H2)
  • Ammonia (NH3)
  • Ozone (O3) - via ozone generator (non-plasma)


Documents

Operating Procedure
Hazard Assessment



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Staff Documents

Operator Manual

Google Drive Live Link
urlhttps://drive.google.com/file/d/1g8WS-mP27XUszJJu8kVLAVVAAKj10XqK/view?usp=drivesdk


Embedded Google Drive Folder
limit100
sortname
urlhttps://drive.google.com/drive/folders/1lSFyIsW8I0pAnhSAM2Tyx0oiYi170nzA


Embedded Google Drive Folder
limit100
sortname
urlhttps://drive.google.com/drive/folders/1kxJdkM9ImCkcGNSgKkt-c11xANQB79WY


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