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Note
iconfalse
titleOverview

Maximum thickness of 3 µm for SiO2‚ or 2 µm for Si3N4 without a system clean. PECVD Si3N4 can be annealed to get tensile stress.



Page properties
idequipment-properties


LMACS NamePECVD (Trion)
Process Area

Equipment process area
EquipmentArea Deposition

ModelOrion PECVD
VendorTrion
Team

Michael Hume Devin Fortier

Aaron Hryciw Scott Munro 




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Serial NumberORN1189
UofA Asset Tag Number424727
Service Contract

Status
colourRed
titleNO




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Contacts


NameCompanyEmailPhone
Technical ContactKapri CianciTrion Techservice@triontech.com+1 727-447-1110
Sales ContactSusanTrion Techsusan@triontech.com



System Features

Wafer Handlingpieces (mounted)100 mm150 mm
Gas SpeciesDCSTEOSNH3
RF Power600 W

Deposition FilmsSiO2Si3N4



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Staff Documents

Operator Manual

Google Drive Live Link
urlhttps://drive.google.com/file/d/1eSf_ozVvWYcLZVYb1QfZ01Bef5qHu9rQ/view?usp=drivesdk

Drive Folder

Embedded Google Drive Folder
limit100
sortname
urlhttps://drive.google.com/drive/folders/1V1X_0pO6WoE5GdoMFD_yDdynGtjcy_eX


Related Documents

Content by Label
cqllabel in ("trion","pecvd")