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A planar magnetron sputtering system with three guns, for deposition of metals only. The gun/substrate configuration is designed for sequential sputtering. |
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Contacts
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System Features
| Sputter Gun Type | 3" guns; two standard guns, one gun for magnetic materials |
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| Gas Species | Ar |
| Power Supply | MDX 500 |
| Substrate Handling | Small pieces on carrier wafers up to several 200 mm diameter full wafers |
| Features | Substrate rotation |
Documents
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| Hazard Assessment | Sputtering System #1 (Bob) HA |
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Staff Documents
Drive Folder
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Related Documents
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