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A planar magnetron sputtering system with three guns, for deposition of metals, or reactive deposition of oxides/nitrides. A substrate holder allows up to a single 150 mm (6") substrate. The third source can be used with magnetic materials. The gun/substrate configuration is designed for co-sputtering. Substrate holder has heating to 150 °C. |
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Contacts
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System Features
| Sputter Guns | 3" guns; two standard guns, one gun for magnetic materials | ||
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| Gas Species | Ar, O2, N2 | ||
| Power | 2 MDX 500 power supplies, DC pulsed power supply, RF power supply for substrate bias (RF etchback) | ||
| Substrate Handling | Small pieces on carrier wafers up to 150 mm diameter full wafers | ||
| Substrate Heating | Up to 150 °C | ||
| Features | Substrate rotation; capable of co-sputtering; reactive sputtering oxides and nitrides (O2 and N2 process gases) | ||
Documents
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| Hazard Assessment | Sputtering System #2 (Doug) HA |
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Staff Documents
Drive Folder
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Related Documents
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