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An AJA Orion 8 planar magnetron sputter system with six 2" sputtering guns, four power supplies (2 DC, 2 RF), and substrate heating. It is a load-locked system with manual specimen transfer and automated (computer-controlled) deposition. The targets in all six guns are switched weekly upon request. Metals, dielectrics, and semiconductor materials may be deposited using this system. |
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Contacts
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System Features
Six 2" sputtering guns with automated power supply and shutter control | |
| QCM for accurate rate testing immediately prior to deposition (not in situ process monitoring) | |
| Substrate heating to 500 °C using quartz lamps (higher temperatures may be allowed on a case-by-case basis) | |
| RF etchback | |
| Plumbed with N2 and O2‚ for reactive sputtering | |
| Turbo-pumped load lock and process chamber | |
| Maximum substrate size: one 100 mm (4") diameter wafer | |
| Tooling available for small and irregular pieces | |
| Rotating substrate holder |
Documents
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| Hazard Assessment | |
| QCM Material Parameters | QCM Material Parameters |
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Staff Documents
Drive Folder
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Related Documents
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