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The Disco DAD 3240 dicing saw is available for cutting glass, quartz, sapphire, and silicon wafers, or bonded wafer pairs thereof. The saw is capable of cutting substrates up to 210 mm diameter. |
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Contacts
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System Features
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| Glass, Sapphire, Silicone blades available |
Documents
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| Hazard Assessment |
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Staff Documents
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Related Documents
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