| Date | Time | Title | Area | Vendor |
|---|
| 12:00 pm, MDT | Increase throughput and quality of your semiconductor deep cross sections, Ga+ free TEM samples, and delayering | Characterization, FIB/SEM | Tescan |
| 1:30 pm, CET | Digital EPDIC luncheon | Characterization | Bruker |
| 8:00 – 8:45 am MDT | Focused Ion Beams for advanced nanofabrication | Fabrication | Raith |
| 9:00 am, MDT | Compositional and Structural Analysis of Thin Films in the SEM using EDS | Characterization, EDX | Oxford |
| 12:00 pm, MDT | Spectroscopic Ellipsometry for Organic Electronic Applications | Characterization, Spectroscopy | Horiba |
| | MSC-SMC Annual Meeting | Characterization, EM | MSC, Various Vendors |
| 9:00 am, MDT | Low Energy X-Ray Microanalysis: Ultim Extreme | Characterization, EDX | Oxford |
| 8:00 – 8:45 am MDT | FIB SEM applications beyond gallium and benefits of AuSi ion beams | Fabrication | Raith |
| 2:00 – 2:45 pm MDT | Maskless Aligner Technology for Thick Resist Applications | Fabrication | Heidelberg |
| 8:00 – 8:45 am MDT | Advanced FIB patterning and large area applications | Fabrication | Raith |
| 1:00 pm, EDT | Recent Advances in X-ray Photoelectron Spectroscopy (XPS) and Near-Ambient Pressure Methods | Characterization, XPS | PHI |
| 2:00 – 2:45 pm MDT | Grayscale Laser Lithography with Heidelberg Instruments DWL Series | Fabrication | Heidelberg |
| | Rigaku Virtual Analytical X-ray Convention | Characterization, XRD | Rigaku |