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The PlasmaPro 80 reactive ion etch (RIE) is a compact, small footprint system offering versatile etch and deposition solutions with convenient open loading. It is easy to site and easy to use, with no compromise on process quality. The open load design allows fast wafer loading and unloading, ideal for research, prototyping and low-volume production. It enables high performance processes using optimised electrode cooling and excellent substrate temperature control. |
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Contacts
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System Features
| Wafer Handling | pieces (unmounted) | 100 mm | 150 mm | |||
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| Gas Species | O2 | CF4 | SF6 | ArAr | CHF3 | N2 |
| RF Power | 300 W | |||||
| Chuck | 5 ºC (min) | 80 ºC (max) | graphite chuck |
Documents
| Operating Procedure | |
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| Hazard Assessment | Oxford NGP80 RIE Hazard Assessment - HA |
| Process Information | Processing on the Oxford NGP80 |
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Staff Documents
Drive Folder
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Related Documents
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