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The PlasmaPro 100 Estrelas platform is designed to give total flexibility for deep reactive-ion etching (DRIE) of Si, serving a diverse set of process requirements across the micro-electromechanical systems (MEMS), advanced packaging, and Nanotechnology markets. Developed with both the research and production markets in mind, the PlasmaPro 100 Estrelas offers the ultimate in process flexibility. |
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Contacts
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Equipment Configuration
Info | ||
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Please refer to the Oxford Estrelas ICPRIE tool page on LMACS for the 100 mm / 150 mm clamp change schedule. |
System Features
Wafer Handling | pieces (mounted) | 100 mm | 150 mm | |
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Gas Species | O2 | C4F8 | SF6 | Ar |
ICP RF Power | 5 kW (2MHz) | |||
Chuck RF Power | 300 W LF (380kHz) | 600 W RF (13.56Mz) | ||
Chuck | -150 ºC (min) | 80 ºC (max) | mechanical clamp | HBC |
Documents
Operating Procedures and Hazard Assessments | |
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Process Information | Processing on the Oxford Estrelas |
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Staff Documents
Drive Folder
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Related Documents
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