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The PlasmaPro 100 Estrelas platform is designed to give total flexibility for deep reactive-ion etching (DRIE) of Si, serving a diverse set of process requirements across the micro-electromechanical systems (MEMS), advanced packaging, and Nanotechnology markets. Developed with both the research and production markets in mind, the PlasmaPro 100 Estrelas offers the ultimate in process flexibility. |
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Contacts
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Equipment Configuration
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Beginning March 11th and every week thereafter, the Estrelas will be in 100 mm mode from Thursday to Monday and for every week thereafter. Changeovers to 100 mm are scheduled to be completed by 11:00 am Thursday morning, and back to 150 mm mode by 3:00 pm Monday afternoon. Please plan accordingly. |
System Features
Wafer Handling | pieces (mounted) | 100 mm | 150 mm | |
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Gas Species | O2 | C4F8 | SF6 | Ar |
ICP RF Power | 5 kW (2MHz) | |||
Chuck RF Power | 300 W LF (380kHz) | 600 W RF (13.56Mz) | ||
Chuck | -150 ºC (min) | 80 ºC (max) | mechanical clamp | HBC |
Documents
Operating Procedure |
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Hazard Assessment |
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Process Information | Processing on the Oxford Estrelas |
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Staff Documents
Drive Folder
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Related Documents
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