| Note | ||||
|---|---|---|---|---|
| ||||
A Toho/KLA-Tencor FLX Series Wafer Stress Measurement System, the Toho FLX-2320-S is an easy to use tool for the measurement of thin film stress utilizing the wafer curvature technique as measured by either a 670 nm or a 780 nm laser. The tool can produce 3D film stress maps as well as monitor time/temperature dependent stress in thin films up to 200 mm thick. |
| Page properties | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ||||||||||||||||
|
| Show If | ||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ||||||||||||||||||||||||
|
| Show If | |||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| |||||||||||||||
Contacts
|
System Features
| Wafer Handling | Round: 3", 4", 5", 6" Square: 100 mm |
|---|---|
| Film Thickness | Up to 200 mm |
| Stress | 1 - 4000 1–4000 MPa |
| Heating | Up to 500 °C in N2 inert gas |
| 3D Stress Mapping | 0 - 180 ° in 15 ° 0–180° in 15° increments |
Documents
| Operating Procedure | |
|---|---|
| Hazard Assessment | Toho FLX-2320-S HA |
| Show If | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ||||||||||||||||
Staff Documents
Drive Folder
|
Related Documents
| Content by Label | ||
|---|---|---|
|