The following is a list of materials that have been used in the nanoFAB. Some items are stocked and others have been authorized for use, but are user supplied. If you would like to work with a material that is not listed here, refer to the instructions on how to Complete a chemical/material import request.
| Material | Composition | Product | Synonyms | Status |
|---|---|---|---|---|
| 2D_CL_PC polymer solution | 94% chloroform, 6 % polycarbonate; liquid | 2D_CL_PC polymer solution | RESTRICTED USE | |
| 3DMAS - Tris(dimethylamino)silane | 99.999%-Si | Tris(dimethylamino)silane | 3DMAS | STOCKED RESTRICTED USE |
| A-174 silane | 70–100% 3-trimethoxysilylpropyl methacrylate, 0.1–1% 4-methoxy-phenol; liquid | A-174 silane | gamma-methacryloxypropyltrimethoxysilane, gamma-MAPS, 3-(trimethoxysilyl)propyl methacrylate | STOCKED |
| Acetone | 100% acetone; liquid | Acetone | 2-propanone, propanone, dimethyl ketone | STOCKED |
| Air Zero (zero air) | 100% Air | Air Zero | Air, Medipure Air, Plasma Air, Zero Air, Air - Diving Grade | STOCKED |
| Aluminum etch | Nitric acid, Phosphoric acid, Acetic acid, Water | Aluminum Etchant Type A | STOCKED | |
| Ammonia | 99.5 - 100% ammonia; gas | Ammonia | NH3 |
|
| Ammonium hydroxide | 70–75% water, 25–30% ammonium hydroxide; liquid | Ammonium hydroxide | ammonia solution, ammonia water, ammonium hydrate | |
| Anisole | 100% anisole; liquid | Anisole | methoxybenzene, methyl phenyl ether, ZEP-A | STOCKED |
| Antimony trisulfide precursor solution | 35.9 wt.% carbon disulfide, 30.3 wt.% ethanol, 28.1 wt.% n-butylamine, 5.7% antimony trioxide; liquid | Antimony trisulfide precursor solution | RESTRICTED USE | |
| APC-AR alloy | ≤100% silver, other components not disclosed; solid | APC-AR alloy (sputtering target) | ||
| APC-TR alloy | ≤100% silver, other components not disclosed; solid | APC-TR alloy (sputtering target) | ||
| AQM SiOx | 100% hydrogen silsesquioxane based polymer; solid | AQM SiOx | HSQ | STOCKED |
| aquaSAVE | 1–6% poly(aniline sulfonic acid), 6–11% isopropyl alcohol, 88–93% water; liquid | aquaSAVE-53za | aquaSAVE | |
| Argon | 99.5% - 100% Argon | Argon Ar | Shielding gas, Argon 40, Extendapak Argon | STOCKED |
| AZ 12XT-20PL-10 photoresist | 55–60% 1-Methoxy-2-propanol acetate, 20–25% Non-hazardous styrene-acrylate polymer, <0.3% 2-Methoxy-1-propanol acetate, 15–20% Cresol novolak resin; liquid | AZ 12XT-20PL-10 photoresist | AZ 12XT | |
| AZ 15nXT (450 CPS) photoresist | 1–3% 1,8-Naphthalimidyl triflate, 0.1–0.3% 2-Methoxy-1-propanol acetate, 50–100% 1-Methoxy-2-propyl acetate; liquid (only hazardous components listed) | AZ 15nXT (450 CPS) photoresist | AZ 15nXT | |
| AZ 300 MIF Developer | >95% water, <3% tetramethylammonium hydroxide; liquid | AZ 300 MIF Developer | ||
| AZ 400K 1:4 Developer | >95% water, <2% potassium borates; liquid | AZ 400K Developer Diluted 1:4 | AZ 400K | STOCKED |
| AZ 726 MIF Developer | >95% water, 1–2.5% tetramethylammonium hydroxide; liquid | AZ 726 MIF Developer | ||
| AZ 1512 photoresist | 75–100% 1-Methoxy-2-propanol acetate, 5% Diazonaphthoquinonesulfonic ester, 19% Cresol novolak resin; liquid | AZ 1512 photoresist | STOCKED | |
| AZ 1529 photoresist | 65–70% 1-Methoxy-2-propanol acetate, 5–10% Diazonaphthoquinonesulfonic ester, 0 - 0.3% 2-Methoxy-1-propanol acetate, 25–30% Cresol novolak resin; liquid | AZ 1529 photoresist | STOCKED | |
| AZ 5214E photoresist | 70–75% 1-Methoxy-2-propanol acetate, 1–5% Diazonaphthoquinonesulfonic ester, <0.3% 2-Methoxy-1-propanol acetate, 20–25% Cresol novolak resin, <2% Phenolic compound; liquid | AZ 5214E photoresist | STOCKED | |
| AZ 9260 photoresist | 55–60% 1-Methoxy-2-propanol acetate, ≤5% Diazonaphthoquinonesulfonic ester, <0.3% 2-Methoxy-1-propanol acetate, 35–40% Cresol novolak resin; liquid | AZ 9260 photoresist | ||
| AZ Developer 1:1 | 99% water, 1% sodium metasilicate; liquid | AZ Developer 1:1 | AZDEV 1:1 | STOCKED |
| AZ P4330-RS photoresist | 65–70% 1-Methoxy-2-propanol acetate, 1–5% Diazonaphthoquinonesulfonic ester, <0.3% 2-Methoxy-1-propanol acetate, 25–30% Cresol novolak resin; liquid | AZ P4330-RS photoresist | ||
| AZ P4620 photoresist | 60–65% 1-Methoxy-2-propanol acetate, 1–5% Diazonaphthoquinonesulfonic ester, 30–35% Cresol novolak resin; liquid | AZ P4620 photoresist | STOCKED | |
| AZ Remover 880 | 1–5% dicarboxylic acid, 50–60% (2-methoxymethylethoxy)propanol, 0–5% sulfonic acid, 30–40% polar aprotic solvent; liquid | AZ Remover 880 | ||
| Benzophenone in xylene solution | ≤40% w/w benzophenone, ≥60% w/w xylenes; liquid | Benzophenone in xylene solution | diphenylmethanone, diphenyl ketone, benzoylbenzene (benzophenone); o-xylene, 1,2-dimethylbenzene, m-xylene, 1,3-dimethylbenzene, p-xylene, 1,4-dimethylbenzene (xylenes) | RESTRICTED USE |
| Bleach | 94–98.9% water, 1–5% sodium hypochlorite, 0.1–1% sodium hydroxide; liquid | Clorox Clean-Up Cleaner + Bleach - Original |