Skip to end of metadata
Go to start of metadata

Overview

Maximum thickness of 3 µm for SiO2‚ or 2 µm for Si3N4 without a system clean. PECVD Si3N4 can be annealed to get tensile stress.

LMACS NamePECVD (Trion)
Confluence Labeltrion-orion-pecvd
Process Area

Deposition

ModelOrion PECVD
VendorTrion
Team



System Features

Wafer Handlingpieces (mounted)100 mm150 mm
Gas SpeciesDCSTEOSNH3
RF Power600 W

Deposition FilmsSiO2Si3N4

Key Documents

SOPTrion PECVD SOP
Hazard Assessment
Process InformationTrion PECVD process information