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nanoFAB Equipment
Standard Operating Procedures (SOP)
Jira links
TPT HB16 Wire bonder SOP
Created by
Gustavo de Oliveira Luiz
on
Oct 20, 2020
Equipment
TPT HB16 Wire bonder
Process Area
Packaging
Location
Characterization Lab, ECERF W1-040
Hazard Assessment
TPT HB16 Wire bonder HA
sop
equipment
wirebonder
packaging
tpt-hb16-wirebonder
Overview
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