System Features
Wafer Handling - Unclamped | Pieces (mounted on carrier wafer), 100 mm round wafers, 150 mm round wafers, 100 mm × 100 mm square wafers |
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Toxic/Flammable/Pyrophoric Gas Species | SiH4, NH3, H2 |
Inert Gas Species | SF6, Ar, He, N2, N2O |
RF Power | 300 W, 13.56 MHz |
Chuck Temperature | 0–350 ºC |
Process Information
Please see the Plasma-Therm PECVD process information page for a listing of qualified recipes and associated data.
Documents
Operating Procedure | |
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Hazard Assessment | Plasma-Therm Versaline PECVD HA |
Related Documents