NOTE
The information given here is merely a reference. Wire bonding parameters are very much sample dependent, and the user should use their own test samples to determine the best working settings for their combination of die and PCB/package.
NOTE
The information below will be update over time, depending on user experience and development by nanoFAB staff.
Pad size and clearance
| Tool setup | Min. Pad size (µm²) | Min. Pitch (µm) |
|---|---|---|
| Au-Ball | 100 x 100 | 150 |
| Au-Wedge | 40 × 50 | 100 |
| Al-Wedge | TBD | TBD |
Gold ball-wedge bonding
Sample tested: Gold pads PCB
| Parameter | Bond 1 | Bond 2 |
|---|---|---|
| US power* (~W) | 200-300 | 250-350 |
| Time (ms) | 200 | 200 |
| Force (mN) | 250-350 | 250-350 |
| Heater (°C) | 75-150 | |
| Up CO (µm) | 500 | |
| EFO power (%) | 100 | |
| Motor speed (%) | 75 | |
* At typical values the units can be considered to be W
Gold wedge-wedge bonding
Sample tested: Gold pads PCB
| Parameter | Bond 1 | Bond 2 |
|---|---|---|
| US power* (~W) | 180-320 | 275-400 |
| Time (ms) | 110 | 110 |
| Force (mN) | 180-300 | 230-400 |
| Heater (°C) | 55-150 | |
| Tail back (µm) | 0 | |
| Tail feed (µm) | 90-120 | |
| Motor speed (%) | 75 | |
* At typical values the units can be considered to be W
Aluminum wedge-wedge bonding
Sample tested: Gold pads PCB
| Parameter | Bond 1 | Bond 2 |
|---|---|---|
| US power* (~W) | 375-400 | 420-450 |
| Time (ms) | 100 | 100 |
| Force (mN) | 300-380 | 410-425 |
| Heater (°C) | 0 (OFF) | |
| Tail back (µm) | 0 | |
| Tail feed (µm) | 120-180 | |
| Motor speed (%) | 75 | |
* At typical values the units can be considered to be W