Process information for Ar sputter clean recipe on the Plasma-Therm Versaline PECVD system. This recipe can be used to improve adhesion for a-Si deposition.
Recipe parameters
| Recipe name |
|
|---|---|
| RF power (W) | 30 |
| Chamber pressure (mTorr) | 600 |
Ar flow (sccm) | 1400 |
| Lower electrode temperature (°C) | 250 |
| Upper electrode temperature (°C) | 175 |
