System Features
Substrate Handling | Load locked single wafer transfer Substrate sizes:
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Substrate Heating | up to 500 ºC | ||||||
Sources | Source 1 - Single Vapour Draw (H2O) Source 2 - Flow through Source 3 - Multi-source Vapour Draw (5 ampoules) Source 4 - Flow-through heated oven | ||||||
Materials |
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Plasma Source Gases | Source 5 - 1 kW RF Remote ICP
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Process Information
Please see the KJLC ALD 150LX process information page for a listing of qualified recipes and associated data.
Documents
Operating Procedure | |
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Hazard Assessment |
Related Documents