Hotplate set-up for most EBL resist spinning applications.

System Features

Uniform and reliable, always set at 180°C
Contact, vacuum, and proximity bake methods
Hotplate substrate sizes: <1 cm to 200 mm round; 8" × 8" square

Programmable lift pins to raise substrates from 0.000" to 0.750" in 0.001" increments

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