System Features
Wafer Handling | Small pieces, 2", 3", 4", 5", 6" wafer capability |
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Process Gases | N2, Ar, forming gas (3%–5% H2 / balance N2) |
Temperature Range | 150–1150 °C (max. 950 °C with susceptor) |
Ramp-Up Rate | Programmable, 10–120 °C/s |
Ramp-Down Rate | Non-programmable, 10–200 °C/s (sample and chamber conditions dependent) |
Steady-State Duration | 0–600 seconds per step (temperature dependent) |
Temperature Repeatability | ±0.5 °C or better at 1150 °C (wafer-to-wafer) |
Temperature Uniformity | ±5 °C across a 6" (150 mm) wafer at 1150 °C |
Documents
Operating Procedure | |
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Hazard Assessment | Allwin AW610 RTA HA |
Recipe Editing | AW610 RTA - Recipe editing procedure |
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