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Overview

Contact lithography mask aligners

System Features

1IR through-wafer imaging for backside alignment (4" diameter wafers with 5" x 5" photomasks only)
2Tooling: 3", 4", and 6" diameter wafers, 4" x 4" square substrates, and small pieces
3Mask tooling: 5" x  5" or 7" x 7" square photomasks
4UV illumination (365 nm & 405 nm)

Key Documents

Operating Procedure
Hazard AssessmentN/A

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