System Features
| 1 | IR through-wafer imaging for backside alignment (4" diameter wafers with 5" x 5" photomasks only) |
|---|---|
| 2 | Tooling: 3", 4", and 6" diameter wafers, 4" x 4" square substrates, and small pieces |
| 3 | Mask tooling: 5" x 5" or 7" x 7" square photomasks |
| 4 | UV illumination (365 nm & 405 nm) |
Key Documents
| Operating Procedure | |
|---|---|
| Hazard Assessment | N/A |